Call Today! (647) 345-7979

Conductive and non-conductive via fill

Epoxy-based products from Peters and San-Ei Kagaka are used for non-conductive via-filling and a silver-coated copper particle filled-epoxy matrix from either DuPont or Tatsuko is usually used for conductive via-filling applications. Both variants require the vias be planarized and plated over to a smooth via land.