OEMs $ EMS
- High Performance Circuit Boards
- Effective cost saving manufacturing
- Commitment to Excellence!
Call us today: (647) 345-7979
Single Sided to 60 Layers
Microvias
Flex/Rigid
RF/Microwave
WORLD CLASS OFFSHORE PCB SOURCING
We offer you all the cost savings of offshore and you receive the benefits of quality, delivery, service and price. We feel that with these factors you will save time and money. We have experience as circuit board professionals with everyone having at least 25 years of experience in our offices in Markham, and abroad. We manage all the inventory from our facility in Markham Ontario.
We are not happy until you are and we strive to ensure that all the products sold by Tiger World are of superior quality and meet all your needs and specifications. We offer high value / high mix / with a focus on quality. If your organization lacks the resources to execute an effective Offshore PCB sourcing program, talk to us at Tiger World. We handle all the details – making it easy for you.
RF/Microwave and Hybrids
market to which we provide special priority is RF/Microwave and Hybrids of high frequency materials bonded to FR4 substrates. Long experience with this technology allows us to mitigate the effects of different CTEs within hybrid products, achieving enhanced coplanarity.
RF/Microwave substrates include:
Rogers 4000 ceramic series
Roger RT/Duroid 5000 and 6000 series
Taconic
Arlon CuClad, DiClad, IsoClad
Buried and Blind Vias
Because of the increasing complexity of design structures BLIND Vias and BURIED Vias are increasingly used in High-Density circuit boards. Mechanically drilled versions of BLIND and BURIED Vias feature multi-sequential lamination processes and multiple mechanical drill operations. that is compliant to the most current European RoHS directive
HDI – High Density Interconnect
HDI technology can often permit the reduction of the number of layers within a PWB, making it possible to manufacture a 4-layer PWB with HDI technology to replace a standard-technology 8-layer. The additional cost for HDI technology can be more than offset by the reduction in cost from going from 8 layers to 4 while taking advantage of increased real estate on the PWB. Trace widths of 0.002” and 0.003” enable HDI technology to drive smartphones and other miniaturized devices.
